Electron-Beam Assisted Etching System


Main Facilities

Electron-Beam Assisted Nanoprocess System
Computer System for Nanostructure Design
Surface Analysis System
Electron-Beam Assisted Epitaxy System
Photolithography System
ECR Sputtering System
Reactive Ion Etching System
Anger Microanalysis System

ECR Sputtering System


Scanning Probe Microscope

Related Facilities

Electron-Beam Assisted Etching System
X-ray Diffraction System
Scanning Electron Microscope
Scanning Probe Microscope
Femtosecond Laser System
Q-Switched YAG Laser System
Micro-Photoluminescence System
Organometallic Vapor Phase Epitaxy System
Sputtering System


Utilities

Clean Room (220 m2)
Nanoprocess Room: Class 1,000
Frontier Device Room: Class 10,000
Ultrapure Water:>18 M
Chiller: Heat Pump
Gas Supply: H2, O2, Ar, He, N2, Air, Liq. N2
Fire Extinguisher, Fireplug, Alarm System
CAD Room

Reactive Ion Etching System


Architectural design of facilities

Lecturing Environment